Z-6044
Dowcorning
2931900090
Siwin-E562
65799-47-5
| Quantity: | |
|---|---|
3-Glycidoxypropyldimethoxymethylsilane (Siwin-E562) is an epoxy-functional organosilane that operates as a coupling agent and adhesion promoter across adhesive, sealant, and coating formulations. Registered under CAS number 65799-47-5, this colorless liquid features an epoxy ring at one end of its molecular structure and two methoxy groups bonded to silicon at the other. This dual-functionality design enables it to bridge inorganic substrates and organic polymer systems.
The dimethoxy structure distinguishes Siwin-E562 from trimethoxy epoxy silanes, offering a controlled hydrolysis rate that can benefit formulation stability in certain systems. The epoxy group reacts with amine, carboxylic acid, and hydroxyl functional groups, while the methoxysilane portion hydrolyzes and condenses with silanol groups on glass, metal, and mineral surfaces. Business buyers in acrylic sealant manufacturing, adhesive production, and coating formulation incorporate this silane to improve bond strength and durability.
Parameter | Specification |
|---|---|
Chemical Name | 3-Glycidoxypropyldimethoxymethylsilane |
CAS No. | 65799-47-5 |
EINECS No. | 265-929-8 |
Molecular Formula | C9H20O4Si |
Molecular Weight | 220.34 g/mol |
HS Code | 2931900090 |
Siwin Product Code | Siwin-E562 |
Equivalent Grade | Dow Corning Z-6044 |
Parameter | Specification |
|---|---|
Appearance | Colorless transparent liquid |
Purity (GC) | ≥ 95.0% |
Density (25°C) | 1.02 g/mL |
Refractive Index (n20/D) | 1.432 |
Flash Point | 105°C |
Boiling Point | 100°C at 4 mmHg |
Vapor Pressure | 3 Pa at 25°C |
Siwin-E562 finds primary application in acrylic sealant formulations where it enhances adhesion to glass, aluminum, and other mineral substrates. The epoxy functional group provides compatibility with acrylic polymer systems, while the silane portion forms covalent bonds with inorganic surfaces. Sealant manufacturers incorporate this additive at loading levels typically ranging from 0.5% to 2.0% by weight to improve peel strength and resistance to moisture-induced adhesion loss. The dimethoxy structure contributes to formulation shelf stability compared to trimethoxy alternatives.
In industrial coating systems, 3-glycidoxypropyldimethoxymethylsilane functions as an adhesion promoter for primers and topcoats applied to metal, glass, and ceramic surfaces. It improves wet adhesion and resistance to humidity and salt spray testing. Coating formulators use it in solvent-based and waterborne systems, with hydrolysis conditions adjusted to match specific formulation requirements.
The epoxy silane serves as a sizing agent for fiberglass and other glass fiber reinforcements used in polymer matrix composites. Treatment of glass fibers with Siwin-E562 improves the interfacial bond between fiber and resin, contributing to enhanced mechanical properties of the composite material including flexural strength and interlaminar shear strength.
Structural adhesive manufacturers incorporate this silane to improve bond strength between dissimilar materials, particularly when joining polymers to metals or glass. The epoxy group participates in curing reactions with amine-based and anhydride-based curing agents, while the silane moiety anchors to inorganic surfaces.
The adhesion promotion mechanism of Siwin-E562 involves two distinct reaction pathways. First, the methoxysilane groups hydrolyze in the presence of moisture, forming reactive silanol (Si-OH) groups. These silanols condense with hydroxyl groups on inorganic substrate surfaces, forming stable Si-O-substrate bonds. Second, the terminal epoxy ring opens under appropriate curing conditions to react with functional groups in the organic polymer matrix, including amines, carboxyls, and hydroxyls. This dual reactivity creates a covalent molecular bridge across the organic-inorganic interface.
Siwin-E562 is available in standard industrial drum packaging for commercial procurement. The material must be stored in tightly sealed containers in a cool, dry environment away from direct sunlight and moisture. Exposure to atmospheric humidity causes gradual hydrolysis of the methoxy groups, which can reduce product effectiveness over time. Properly stored material maintains specification compliance for a minimum of 12 months from the date of manufacture. Material Safety Data Sheets are provided with each shipment.
Siwin manufactures Siwin-E562 under controlled production conditions with batch-level quality verification. Each production lot undergoes gas chromatography analysis to confirm purity levels, alongside refractive index measurement and density testing. Certificates of Analysis accompany every delivery, providing batch-specific data for incoming quality inspection by enterprise customers. The production facility maintains consistent output capacity to support both standard orders and custom volume requirements from industrial clients.
Dimethoxy epoxy silanes such as 3-glycidoxypropyldimethoxymethylsilane contain two methoxy groups per molecule, while trimethoxy variants contain three. The dimethoxy structure offers slower hydrolysis kinetics and lower crosslink density, which can benefit formulation stability and flexibility in certain adhesive and sealant systems. The choice depends on specific application requirements.
Typical addition levels range from 0.5% to 2.0% by weight of the total formulation. The optimal dosage depends on formulation composition, substrate type, and performance requirements. Formulators often conduct trials across this range to determine the most cost-effective loading level.
Siwin-E562 is formulated to match the chemical composition and performance characteristics of Dow Corning Z-6044 grade epoxy silane. Both products share the same CAS number (65799-47-5) and chemical structure. Users should verify performance in their specific formulations.
The epoxy group reacts with amine functional groups at ambient or elevated temperatures, and with carboxylic acid or anhydride groups under appropriate thermal conditions. This reactivity makes the silane compatible with epoxy, polyurethane, and certain acrylic curing systems.
